Xuyuan Precision is pleased to announce the successful conclusion of its participation in the CIME Shenzhen International Thermal Conductivity and Heat Dissipation Exhibition, held from June 10 to June 12 at the Shenzhen World Exhibition & Convention Center. Over the course of the three-day event, Xuyuan Precision’s booth (16H23) in Hall 16 served as a dynamic hub for industry professionals, drawing significant interest from data center operators, cloud service providers, and thermal management engineers.
The 2026 edition of CIME, held alongside the Shenzhen International AI Computing Power Industry Exhibition and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition, underscored the critical importance of advanced thermal solutions in the AI era. With AI large models driving unprecedented power densities, the industry’s focus has decisively shifted toward liquid cooling and high-efficiency heat dissipation as mandatory components of sustainable computing infrastructure.
Throughout the exhibition, the Xuyuan Precision team engaged in in-depth technical discussions with attendees, addressing specific cooling challenges and exploring collaborative opportunities for future projects. The response highlighted a growing market demand for reliable, high-precision thermal components as the digital economy continues to expand.
Xuyuan Precision extends its gratitude to all visitors, partners, and organizers who contributed to a successful event. We remain committed to advancing thermal management innovation and invite interested parties to reach out for further discussions on customized solutions.
Contact Information
For more information about Xuyuan Precision’s products and services, please visit or contact jason@xyjmrk.cn.
Post time: Jul-10-2026
