Xuyuan Precision
High-Precision Aluminum Liquid Cold Plate Assembly
Application
Designed for demanding thermal management in high-power electronic and industrial applications, this liquid cooling plate assembly provides efficient, direct liquid cooling to ensure maximum performance and operational stability. Key applications include:
Power Semiconductor Modules: Ideal for high-density IGBT and Silicon Carbide (SiC) power module thermal control.
Energy Storage Systems (ESS): Liquid-cooled battery packs, energy conversion systems (PCS), and containerized storage units.
EV Charging Infrastructure: Superchargers, fast-charging power cabinets, and electric vehicle powertrain inverters.
Industrial Drives & Automation: High-power frequency converters, servo drives, and heavy-duty motor controllers.
Data Centers & Telecom: Liquid cooling for high-performance computing (HPC) servers and telecommunication power supplies.
Medical & Laser Equipment: Precision thermal stabilization for laser diodes and high-power medical devices.
Parameters
| Specification Item | Technical Details |
|---|---|
| Product Name | Precision Liquid Cold Plate Assembly (Substrate & Cover Plate) |
| Base / Cover Material | Premium AL6063-T5 High-Thermal-Conductivity Aluminum Alloy |
| Envelope Dimensions | Approx. 605 mm (L) × 576.5 mm (W) × 52 mm (H) |
| Cooling Port Interface | Internal Thread BC3/4-14 (Thread Depth: 30 mm) |
| Sealing & Dispensing | Automated Polyurethane (PU) Foam Glue Dispensing (Height: 3.5 +0/-0.3 mm, Depth: 2.0 mm) |
| Surface Treatment | Selective Conductive Oxidation (Chromate Conversion) on non-mounting surfaces; Bare polished aluminum on thermal module mounting areas |
| Mounting Holes & Bores | Precision CNC matrices: 36× M5 (Depth 12mm), 20× M6 (Depth 12mm), 14× M5 (Depth 12mm), 10× Ø14 Thru, 6× Ø9 Thru |
| Delivery Condition | Water nozzles pre-assembled and shipped together as a turnkey unit |
| Quality & Finish | 100% deburred, high flatness tolerance, zero obvious scratches |
Product Features
Selective Conductive Oxidation for Optimized Heat Transfer: Except for the bare aluminum module contact faces, all interior and exterior surfaces undergo conductive oxidation (chromate conversion). This preserves ultra-low interface thermal resistance under power modules while offering superior corrosion resistance and electrical grounding across the rest of the body.
Dual Leak-Tight Protection & PU Foam Sealing: Combines precision structural plate welding (connecting the substrate and cover plate) with automated Polyurethane (PU) foam sealant dispensing in specialized channels (3.5 mm dispensing height). This ensures zero fluid leakage under dynamic operational pressure.
High-Precision CNC Machining: Engineered with complex arrays of M5/M6 threaded mounting holes and stepped counterbores, ensuring precise component alignment, uniform contact pressure, and rapid thermal transfer.
Exceptional Flatness & Surface Integrity: Strictly deburred and polished surface finish with high flatness controls, ensuring ideal thermal interface contact with power modules.
Processing & Manufacturing
Precision CNC Machining: High-speed CNC multi-axis milling of AL6063-T5 aluminum extrusions to create internal cooling fluid channels, mounting hole arrays, and smooth module mounting faces.
Structural Welding: The cover plate is joined to the substrate base via specialized welding technology, forming a high-strength, hermetically sealed internal fluid chamber.
Masked Surface Conductive Oxidation: Module contact surfaces are masked prior to chemical conductive oxidation, striking the perfect balance between anti-corrosion protection and maximum thermal conductivity.
Assembly, Leak & Quality Inspection: Pre-assembly of BC3/4-14 liquid nozzles, 100% pressure and leak testing, surface deburring, dimensional inspection, and protective packaging prior to shipment.
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