Electronic devices, automotive industry, computers and servers, medical equipment.
Manufactured using skiving technology, aluminum or copper profiles are processed into high-density, high-aspect-ratio fins, significantly increasing the heat dissipation surface area. Compared to conventional heat sinks, thermal performance is improved by 8–15%. The skived fins are extremely thin (0.05 mm – 2 mm), densely packed, and achieve thermal conductivity approaching the theoretical limit of the base material.
Bonded fin heat sinks are typically chosen for small-batch production or large single-unit heat sinks. The selection of materials and manufacturing processes significantly impacts heat sink performance, affecting device lifespan and overall system reliability.
Material & Manufacturing Quality:The thermal conductivity of bonded fin heat sinks is heavily influenced by material purity, thickness, and alloy type (e.g., 1060 aluminum, known for strong corrosion resistance and excellent heat dissipation). Poor material quality or defective processes (e.g., casting cracks, shrinkage voids from machining) will degrade heat transfer efficiency.
Surface Finish & Flatness:The surface roughness and flatness of the contact interface directly affect thermal contact resistance and pressure drop.
Assembly Integrity:The riveted joints between the base plate and fins must be secure and smooth to prevent fin loosening or dust accumulation, which could impair functionality or cooling performance.
Engraving Machines, CNC Lathes, High-speed Engraving and Milling Machines, Drilling and Tapping Machines, 3-axis/4-axis/5-axis CNC Machining Centers, Swiss-type Lathes, Turn-Mill Centers
1. Material Quality Inspection
2. Dimensional (or Precision) Quality Inspection
3. Appearance Quality Inspection
4. Functional Quality Inspection
5. Structural Quality Inspection
6. Surface Treatment Quality Inspection
7. Packaging Quality Inspection